Publication No: 5695Search all ORC publications    

Silicon p-i-n junction fibers

Dr.R.R.He, T.D.Day, J.R.Sparks, Prof.J.V.Badding
Department of Chemistry and Materials Research Institute, Pennsylvania State University, University Park, PA 16802, USA

Dr.M.Krishnamurthi, Prof.V.Gopalan
Department of Materials Science and Engineering and Materials Research Institute, Pennsylvania State University, University Park, PA 16802, USA

Dr.P.J.A.Sazio
Optoelectronic Research Centre, University of Southampton, UK

Abstract

Conventional wafer-based microelectronics are typically fabricated on a length scale of millimeters to centimeters on rigid substrates. Extending electronic function to longer length scales and more flexible forms has long been of interest for a wide range of application areas such as power generation, chemical sensing, foldable displays, and biomedical devices (e.g., epidermal electronics). 1D fibers are now emerging as flexible structures that can allow electronic function to be exploited over length scales from meters to even kilometers, and can also be configured into large 2D woven structures and 2D and 3D arrays. These fibers are further extending the scope of the field to applications such as 3D photodetectors, imaging fabrics, and telecommunications, with many more applications possible with further improvements in electronic fiber device performance.


Advanced Materials (2013) Vol.25(10) pp.1461-1467

doi: 10.1002/adma.201203879

Southampton ePrint id: 349395

 

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